GSMFIX TOOLS Universal 3D BGA Reballing Stencil

DESCRIPTION

The GSMFIX TOOLS Universal 3D BGA Reballing Stencil is an indispensable tool for professional electronics repair, offering unparalleled versatility and stability for restoring BGA components. This 3D-structured, high-precision stencil is thickened for direct heating compatibility and features multiple templates supporting a wide range of solder ball pitches, including 0.3mm,0.35 mm, 0.4mm, and 0.5mm.

Crafted from durable, high-temperature resistant steel, the 3D design provides superior stability, allowing technicians to achieve flawless reballing results on motherboards, CPUs, and other critical ICs with enhanced ease and precision. Streamline your rework process and boost your success rate with this essential, all-in-one 3D solution.

KEY FEATURES

• 3D High-Temperature Design: Features a strengthened, thicker “3D” structure which provides superior stability during heating and helps contain solder paste better, improving the success rate of the reballing process.
• Supports Direct Heating: The robust 3D material and thickness make this stencil suitable for direct heating using a hot air rework station, allowing the user to form solder balls while the stencil is still on the chip.
• Universal Multi-Pitch Design: Features a comprehensive array of templates supporting various solder ball pitches, including 0.3 mm, 0.35 mm, 0.4 mm, and 0.5 mm, making it compatible with a wide range of BGA ICs.
• Diverse Grid Sizes: Includes multiple grid dimensions (e.g., 0.4 x 32 x 32, 0.3 x 50 x 50, 0.35 x 48 x 48, etc.) to match different BGA chip footprints.
• High-Precision Alignment: Each template is meticulously etched to ensure perfect alignment with BGA pads, facilitating precise solder paste application and uniform ball formation.
• Cost-Effective Solution: A single universal stencil replaces the need for multiple single-purpose stencils.