GSMFIX RT-360 Transparent Flux Paste

DESCRIPTION

The GSMFIX RT-360 Flux Paste focuses on user experience and clarity, specifically highlighting its transparent nature, which is a major benefit for inspection after soldering. The addition of No-Clean and Low Smoke features makes it an excellent choice for a wide range of professional environments.

RT-360 Transparent Flux Paste is engineered for precision rework where post-soldering inspection is critical. Its defining feature is the highly transparent residue it leaves behind, allowing technicians to immediately and clearly verify the integrity of the solder joint without the time-consuming step of cleaning.

This premium paste features a No-Clean, Low Smoke formula, guaranteeing a cleaner workstation and eliminating the need for extensive residue removal. The natural, minimal smoke and excellent wettability ensure a smooth, professional soldering process, making the RT-360 the ideal, user-friendly flux for all demanding repair tasks, including micro-soldering and BGA rework.

KEY FEATURES

• Transparent Residue: The most crucial feature—the flux residue left after soldering is highly transparent. This allows technicians to easily inspect solder joints for quality, bridging, or cold connections without needing to clean the area first.
• Low Smoke Formula: Engineered to produce minimal, natural smoke during the soldering process, leading to a safer, cleaner, and more comfortable working environment.
• No-Clean Convenience: Features a No-Clean formula, meaning the non-corrosive residue does not need to be removed from the PCB after soldering, saving time and cleaning materials.
• Excellent Wettability: Provides strong activation and excellent wetting action, promoting smooth solder flow and ensuring strong, high-quality solder joint formation on pads and component leads.
• Consistent Viscosity: Has a stable, medium viscosity (tacky) suitable for precise dispensing via syringe or for application during BGA reballing, stenciling, and SMD component placement.
• Versatile Application: Ideal for general electronics repair, mobile phone motherboard rework, BGA, and fine-pitch soldering, offering reliability for both lead-free and traditional solder alloys.