GSMFIX TOOLS RT-2015 Soldering Wick (2.0mm x 1.5m)

DESCRIPTION

Enhanced Width (2.0mm): The 2.0 mm width provides a larger surface area, allowing for faster and more complete removal of solder from medium to large pads, component joints, and wide solder bridges.

Premium Copper Braid: Crafted from high-purity, tightly braided, oxygen-free copper for superior thermal conductivity and maximizing the speed of solder wicking.

Active Flux Formula: Pre-treated with a specialized, mild, non-corrosive, non-clean flux. This ensures the wick activates quickly, draws molten solder rapidly, and leaves minimal residue.

High Solder Absorption: The robust braid structure is designed for maximum capillary action, enabling the wick to safely and quickly remove large amounts of solder, protecting sensitive components from prolonged heat exposure.

Standard Length: Provides 1.5 m approximately 5 ft. of wick on a convenient, easy-to-dispense spool.

Versatile Application: Ideal for general rework, desoldering connectors, removing tinning from wire ends, and preparing larger component pads for reinstallation.

KEY FEATURES

• Enhanced Width (2.0mm): The 2.0 mm width provides a larger surface area, allowing for faster and more complete removal of solder from medium to large pads, component joints, and wide solder bridges.
• Premium Copper Braid: Crafted from high-purity, tightly braided, oxygen-free copper for superior thermal conductivity and maximizing the speed of solder wicking.
• Active Flux Formula: Pre-treated with a specialized, mild, non-corrosive, non-clean flux. This ensures the wick activates quickly, draws molten solder rapidly, and leaves minimal residue.
• High Solder Absorption: The robust braid structure is designed for maximum capillary action, enabling the wick to safely and quickly remove large amounts of solder, protecting sensitive components from prolonged heat exposure
• Standard Length: Provides 1.5 m (approximately 5 ft) of wick on a convenient, easy-to-dispense spool.
• Versatile Application: Ideal for general rework, desoldering connectors, removing tinning from wire ends, and preparing larger component pads for reinstallation.