GSMFIX Tools 858D+ Hot Air Rework Station | 680W Digital SMD Hot Gun

DESCRIPTION

The GSMFIX Tools 858D+ Hot Air Rework Station is a professional-grade, high-performance tool engineered for precision Surface Mount Device (SMD) repair and electronics rework. Equipped with a powerful 680W heating core and an advanced Microcomputer PID Control system, it delivers ultra-fast heat-up and rock-solid temperature stability, making it essential for complex tasks like BGA, IC, QFP, and mobile phone motherboard chip repair.

Its key feature is the Intelligent Auto-Sleep function, which automatically cools the element and enters standby when the handle is placed on its holder, ensuring maximum safety and tool longevity. The Brushless Vortex Fan provides a gentle, consistent, and low-noise airflow, protecting sensitive components from thermal shock or displacement.

Whether you are a professional technician in a repair shop or a serious electronics hobbyist, the 858D+ offers the precision, reliability, and control needed to achieve professional desoldering and soldering results every time.

KEY FEATURES

• Highlight the most important benefits that technicians and hobbyists look for:
• High-Power 680W Heating Element: Rapid heat-up time and excellent temperature stability for efficient, demanding rework tasks.
• Microcomputer PID Control: Features a closed-loop sensor and microcomputer control for precise, real-time temperature tracking and stability ($ \pm 1^\circ\text{C}$).
• Digital LED Display: Clear, real-time display of the set and actual temperature, enabling accurate and repeatable work.
• Intelligent Auto-Sleep Function: Automatically cools down and enters standby mode when the handle is placed on its holder, significantly prolonging the life of the heating element.
• Brushless Vortex Fan: Provides a large, soft, and gentle rotating airflow (up to 120 L/min), ideal for safely desoldering sensitive components without causing damage.
• Adjustable Airflow & Temperature: Independent control knobs allow for fine-tuning of both air volume and temperature to suit a wide variety of SMD components (SOP, CHIP, QFP, PLCC, BGA, etc.).